Model SYS-222GS-NB3OT-ALC
The most compact hyperscale HGX B300 platform — up to 144 liquid-cooled GPUs in one 21-inch rack.
This 2-OU Supermicro system is the most compact HGX B300 platform, built for 21-inch OCP Open Rack V3. Up to 18 nodes, or 144 liquid-cooled Blackwell Ultra GPUs, fit in a single rack.
Power arrives over the OCP 48–52 V DC busbar and cooling through blind-mate manifolds, which suits hyperscale and cloud operators standardising on OCP infrastructure.
Up to 18 eight-GPU nodes in one ORV3 rack.
2.3 TB HBM3e per node, 1.8 TB/s NVLink.
1400 A busbar with power shelves and DC-SCM support.
Cold plates on CPUs and GPUs for sustained full TDP.
800 Gb/s OSFP per GPU.
NVIDIA-Certified and OCP Accepted design.
| CPUs | Dual Intel Xeon 6700 series with P-cores, up to 86C/172T, up to 350 W (liquid-cooled) |
|---|---|
| Memory | 32 DIMM slots; up to 4 TB DDR5-6400 (1DPC) or 8 TB DDR5-6000 (2DPC) |
| GPUs | NVIDIA HGX B300 8-GPU (288 GB each) |
|---|---|
| CPU-GPU interconnect | PCIe 5.0 x16 |
| GPU-GPU interconnect | NVIDIA NVLink with NVSwitch |
| Drive bays | 8× front hot-swap E1.S NVMe |
|---|---|
| Boot | 2× M.2 NVMe |
| Compute network | 8× 800 Gb/s OSFP (ConnectX-8 SuperNIC) |
| LAN | 2× 10 GbE RJ45; 1× 1 GbE BMC (DC-SCM) |
| Expansion | 2× PCIe 5.0 x16 FHHL |
| Form factor | 2-OU, 21-inch OCP ORV3 |
|---|---|
| Dimensions (H × W × D) | 94 × 537 × 805 mm |
| Weight | 70 kg net |
| Power | 48–52 V DC via OCP busbar |
| Cooling | Direct-to-chip cold plates plus 4× 80 mm and 4× 40 mm fans |
| Operating temperature | 10 °C to 35 °C |
| Certifications | NVIDIA-Certified Systems, OCP Accepted |
Front-I/O air-cooled server for 8× 1100 W Blackwell Ultra GPUs with integrated 800 Gb/s networking.
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Best-selling air-cooled 8-GPU platform, redesigned for Blackwell with front or rear I/O.
Tell us your workload and timeline for the Supermicro 2-OU OCP ORV3 HGX B300 System. We reply within one business day with a configuration, pricing and lead time.