Model SYS-822GS-NB3RT
Front-I/O air-cooled server for 8× 1100 W Blackwell Ultra GPUs with integrated 800 Gb/s networking.
This 8U air-cooled Supermicro system runs a full NVIDIA HGX B300 8-GPU board with 2.3 TB of HBM3e and eight integrated ConnectX-8 SuperNICs at 800 Gb/s. Its front-I/O layout keeps networking and service access on the cold aisle.
It is the straightforward way to deploy Blackwell Ultra in existing air-cooled data centers. Intel Xeon 6 is shown here; AMD EPYC variants are also offered.
288 GB HBM3e per GPU, 2.3 TB per system, 1.8 TB/s NVLink.
Eight 800G OSFP ports for the compute fabric.
Up to 86 cores per CPU and 350 W TDP.
32 DIMM slots, up to 6400 MT/s.
Up to 12 heavy-duty fans; no liquid cooling infrastructure needed.
Six 6.6 kW Titanium-level power supplies.
| CPUs | Dual Intel Xeon 6700 series with P-cores, up to 86C/172T, up to 336 MB cache, up to 350 W |
|---|---|
| Memory | 32 DIMM slots; up to 4 TB DDR5-6400 (1DPC) or 8 TB DDR5-6000 (2DPC) ECC RDIMM |
| GPUs | NVIDIA HGX B300 8-GPU (288 GB each) |
|---|---|
| GPU memory | 2.3 TB HBM3e per system |
| Interconnect | NVIDIA NVLink with NVSwitch, 1.8 TB/s |
| Drive bays | 8× front hot-swap E1.S NVMe |
|---|---|
| Boot | 2× M.2 NVMe |
| Compute network | 8× 800G OSFP (NVIDIA ConnectX-8 SuperNIC) |
| LAN | 2× 10 GbE RJ45 (Intel X710) |
| Expansion | 2× PCIe 5.0 x16 FHHL |
| Form factor | 8U rackmount, front I/O |
|---|---|
| Dimensions (H × W × D) | 356 × 449 × 950 mm |
| Weight | 119 kg net |
| Power | 6× 6.6 kW redundant (3+3) Titanium (96%) |
| Cooling | Up to 12 heavy-duty fans |
| Security | TPM 2.0, Silicon Root of Trust (NIST 800-193), Secure Boot |
| OS support | RHEL 9.6 / 10.0, RHEL AI, Oracle Linux 9.6, VMware ESXi 8.0U3 / 9.x |
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Best-selling air-cooled 8-GPU platform, redesigned for Blackwell with front or rear I/O.
Tell us your workload and timeline for the Supermicro 8U Air-Cooled HGX B300 System. We reply within one business day with a configuration, pricing and lead time.