Model SYS-422GS-NB3RT-LCC
DLC-2 liquid-cooled 8-GPU node capturing up to 98% of heat for dense, efficient AI factories.
This 4U Supermicro system packs a liquid-cooled NVIDIA HGX B300 8-GPU board into half the height of the air-cooled version. Direct-to-chip cold plates remove most of the heat, so racks can hold far more GPUs.
It is part of Supermicro's DLC-2 stack, which runs on 45 °C warm water to cut chiller use, and ships as rack-level (L11) or cluster-level (L12) validated solutions.
2.3 TB HBM3e per system with 1.8 TB/s NVLink.
Direct-to-chip cold plates; up to 40% data center power savings.
Reduces water use and can eliminate chillers and compressors.
Up to 800 Gb/s per GPU, plus 4 PCIe Gen 5 x16 slots.
4U per 8 GPUs for high GPU counts per rack.
Racks and clusters are tested before shipping.
| CPUs | Dual Intel Xeon 6700 series with P-cores, up to 350 W |
|---|---|
| Memory | 32 DIMMs; up to 8 TB at 5200 MT/s or 4 TB at 6400 MT/s DDR5 RDIMM |
| GPUs | NVIDIA HGX B300 8-GPU |
|---|---|
| GPU memory | 2.3 TB HBM3e per system |
| Interconnect | Fifth-generation NVLink, 1.8 TB/s |
| Drive bays | 8× hot-swap E1.S NVMe |
|---|---|
| Boot | 2× M.2 NVMe |
| Compute network | 8× NVIDIA ConnectX-8 SuperNICs, up to 800 Gb/s |
| Expansion | 4× PCIe Gen 5 x16 |
| Form factor | 4U rackmount |
|---|---|
| Dimensions (W × H × D) | 448 × 174 × 896.8 mm |
| Weight | 84.6 kg net |
| Power | 4× 6.6 kW redundant (2+2) Titanium |
| Cooling | Direct-to-chip (D2C) cold plates, Supermicro DLC-2 |
Front-I/O air-cooled server for 8× 1100 W Blackwell Ultra GPUs with integrated 800 Gb/s networking.
The most compact hyperscale HGX B300 platform — up to 144 liquid-cooled GPUs in one 21-inch rack.
Best-selling air-cooled 8-GPU platform, redesigned for Blackwell with front or rear I/O.
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